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FSBB30CH60DF Fa'amatalaga Fa'atekinolosi

MODULE SPM 600V 30A SPMPA

Uiga Oloa Uiga Taua
Category Discrete Semiconductors / Kwasa Mwambo Mwambo
Manufacturer ON Semiconductor
Factory Lead Time 3 Weeks
Factory Lead Time 14 Weeks
Mount Through Hole
Package / Case 27-PowerDIP Module (1.205, 30.60mm)
Published 2016
JESD-609 Code e3
Part Status Not For New Designs
ECCN Code EAR99
Terminal Finish Tin (Sn)
Min Operating Temperature -40°C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Voltage - Isolation 2500Vrms
Max Current Rating 30A
Min Breakdown Voltage 600V
Uiga Oloa Uiga Taua
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Lifecycle Status ACTIVE, NOT REC (Last Updated: 2 days ago)
Mounting Type Through Hole
Weight 21.978g
Series Motion SPM® 3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type IGBT
Max Operating Temperature 150°C
HTS Code 8541.29.00.95
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Configuration 3 Phase Inverter
Collector Emitter Voltage (VCEO) 2.1V
RoHS Status ROHS3 Compliant
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O isi e aofia ai   "FSBB3"   vaega

O vaega nei e aofia ai  'FSBB3' 

Vaega # Tufuga Vaega Avanoa
FSBB30CH60 Fairchild/ON Semiconductor Muduli ya Dereva ya Nguvu 2841
FSBB30CH60 AMI Semiconductor / ON Semiconductor Muduli ya Dereva ya Nguvu 2971
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FSBB30CH60B Fairchild/ON Semiconductor Muduli ya Dereva ya Nguvu 2452
FSBB30CH60B AMI Semiconductor / ON Semiconductor Muduli ya Dereva ya Nguvu 2928
FSBB30CH60B Rochester Electronics, LLC Kwasa Mwambo Mwambo
FSBB30CH60B ON Semiconductor Kwasa Mwambo Mwambo
FSBB30CH60C Fairchild/ON Semiconductor Muduli ya Dereva ya Nguvu 5422
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