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M2S010TS-VFG256 Fa'amatalaga Fa'atekinolosi

IC FPGA SOC 10K LUTS

Uiga Oloa Uiga Taua
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 3 Weeks
Supplier Device Package 256-FPBGA (17x17)
Series SmartFusion®2
Peripherals DDR, PCIe, SERDES
Package / Case 256-LBGA
Number of I/O 138
MCU Flash 256KB
Connectivity CAN, Ethernet, I²C, SPI, UART/USART, USB
Uiga Oloa Uiga Taua
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 166MHz
Primary Attributes FPGA - 10K Logic Modules
Packaging Tray
Operating Temperature 0°C ~ 85°C (TJ)
MCU RAM 64KB
Core Processor ARM® Cortex®-M3
Architecture MCU, FPGA
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O isi e aofia ai   "M2S01"   vaega

O vaega nei e aofia ai  'M2S01' 

Vaega # Tufuga Vaega Avanoa
M2S010-1FG484 Microsemi Embedded - System On Chip (SoC) 2522
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M2S010-1FGG484 Microsemi Embedded - System On Chip (SoC) 2603
M2S010-1FGG484 Microsemi Corporation SoC
M2S010-1FGG484I Microsemi Embedded - System On Chip (SoC) 2618
M2S010-1FGG484I Microsemi Corporation SoC
M2S010-1TQ144 Microsemi Embedded - System On Chip (SoC) 2791
M2S010-1TQ144 Microsemi Corporation SoC

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Tel : 86-755-86374759

imeli : [email protected]

tuatusi : D1 6th floor,Lehui Center,Jihua Road 489 Longgang District, Shenzhen-518129, China

Fa'atauga Taiala

Va'a Vaitaimi Tiliva O afifi o le a faʻatulagaina mo le tuʻuina atu i totonu ole 1-2 aso mai le aso o mea uma e taunuu i le matou faleteuoloa. E mafai ona lafo i fafo mea i totonu ole 24 itula. E fa'alagolago le Taimi o Va'a i Metotia o Va'a ma Tu'uga Tu'u atu.
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M2S010TS-VFG256 tagata gaosi oloa: Microsemi, Bonchip fa'asoa, M2S010TS-VFG256 tau faasinomaga. M2S010TS-VFG256 tapula'a, M2S010TS-VFG256 Pepa fa'amaumauga PDF ma pine fa'amatalaga fa'amatalaga download.E mafai ona e fa'aogaina le M2S010TS-VFG256 Pluggable Connectors, DSP Datesseet PDF, su'e M2S010TS-VFG256 pine faʻataʻitaʻiga ma faʻataʻamilosaga faʻataʻitaʻiga ma le faʻaaogaina o le faʻaogaina o le gaioiga, M2S010TS-VFG256 aoaoga faaeletonika.E mafai ona e sii maia mai le Bonchip.
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