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0447641801 Fa'amatalaga Fa'atekinolosi

Conn Wire to Board RCP 18 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

Uiga Oloa Uiga Taua
Category Koŋekto / IC na Sockets ya Component
Manufacturer Molex
Factory Lead Time 3 Weeks
Factory Lead Time 9 Weeks
Mount Through Hole
Contact Shape Square
Housing Material Nylon
Packaging Tray
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Receptacle
Applications General Purpose, Telecommunications
Voltage - Rated 600VAC
Contact Finish - Mating Tin
DIN Conformance NO
Filter Feature NO
Mixed Contacts NO
Terminal Pitch 3mm
Insulation Height 0.402 10.20mm
Number of Positions Loaded All
Pitch - Mating 0.118 3.00mm
Contact Length - Post 0.155 3.94mm
Housing Color Black
Length 27.7mm
Contact Finish Thickness - Post 40.0μin 1.02μm
RoHS Status ROHS3 Compliant
Uiga Oloa Uiga Taua
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Contact Material Phosphor Bronze
Mounting Type Through Hole, Right Angle
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Operating Temperature -40°C~105°C
Series Micro-Fit 3.0 BMI 44764
Feature Board Guide
Part Status Active
Termination Solder
Number of Positions 18
Number of Rows 2
Fastening Type Push-Pull
MIL Conformance NO
IEC Conformance NO
Contact Type Female Socket
Orientation Right Angle
Depth 21mm
Style Board to Board or Cable
Current Rating 5A
Row Spacing - Mating 0.118 (3.00mm)
UL Flammability Code 94V-0
Number of Circuits 16
Contact Finish Thickness - Mating 40.0μin 1.02μm
Material Flammability Rating UL94 V-0
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