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SI3008-A-FS Fa'amatalaga Fa'atekinolosi

IC ISOMODEM FCC LINE-SIDE 8SOIC

Uiga Oloa Uiga Taua
Category Integrated Circuits (ICs) / Interface - Modems - ICs na Modules
Manufacturer Energy Micro (Silicon Labs)
Factory Lead Time 3 Weeks
Voltage - Supply -
Series ISOmodem®
Package / Case 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Data Format V.22, V23, V.32, V.34, V.90, Bell 103, Bell 212A
Uiga Oloa Uiga Taua
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Supplier Device Package 8-SOIC-EP
Packaging Tube
Mounting Type Surface Mount
Baud Rates 2.4k
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SI3008-A-FS Pepa

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O isi e aofia ai   "SI300"   vaega

O vaega nei e aofia ai  'SI300' 

Vaega # Tufuga Vaega Avanoa
SI3000 SILICON Specialized Hot ICs 23857
SI3000-C-FS Energy Micro (Silicon Labs) Interface - KODEKs 5676
SI3000-C-FS Silicon Labs CODECs Interface ICs
SI3000-C-FSR Energy Micro (Silicon Labs) Interface - KODEKs 5291
SI3000-C-FSR Silicon Labs CODECs Interface ICs
SI3000-C-FSR IC Energy Micro (Silicon Labs) Specialized Hot ICs 1101
SI3000-C-GS Energy Micro (Silicon Labs) Interface - KODEKs 5734
SI3000-C-GS Silicon Labs CODECs Interface ICs
SI3000-C-GSR Energy Micro (Silicon Labs) Interface - KODEKs 2642
SI3000-C-GSR Silicon Labs CODECs Interface ICs

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Tel : 86-755-86374759

imeli : [email protected]

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Afai ei ai sau fa'afitauli fa'agaioiga, fa'amolemole lagona le saoloto e fa'afeso'ota'i le matou tagata fa'atau.
Totogi TT i luma atu (faʻasalalau faletupe), Western Union, Credit card, PayPal. O le tagata faatau e nafa ma totogifuapauina o felauaiga, totogi o faletupe, tiute ma lafoga.
SI3008-A-FS tagata gaosi oloa: Energy Micro (Silicon Labs), Bonchip fa'asoa, SI3008-A-FS tau faasinomaga. SI3008-A-FS tapula'a, SI3008-A-FS Pepa fa'amaumauga PDF ma pine fa'amatalaga fa'amatalaga download.E mafai ona e fa'aogaina le SI3008-A-FS Pluggable Connectors, DSP Datesseet PDF, su'e SI3008-A-FS pine faʻataʻitaʻiga ma faʻataʻamilosaga faʻataʻitaʻiga ma le faʻaaogaina o le faʻaogaina o le gaioiga, SI3008-A-FS aoaoga faaeletonika.E mafai ona e sii maia mai le Bonchip.
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